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Voith supplies technologies for PM 2 rebuild at Schumacher Packaging in Myszków, Poland
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Voith and Schumacher Packaging have successfully started up PM 2 in Myszków, Poland. Except for a few existing components, the entire production line was modernized to achieve the highest sustainability and efficiency standards.

The successful rebuild of the PM 2 will significantly increase the production capacity of lightweight containerboard grades. In the interest of the customer, the highest priority was placed on sustainability, machine availability and process efficiency when planning the rebuild.

Voith had already modernized the plant's OCC stock preparation line in 2018. To meet the increased production capacity and further increase plant efficiency, the OCC line has now been expanded with additional technologies from Voith's BlueLine portfolio; sensor technology from BTG; and technologies for water, reject, and sludge handling from Meri.

State-of-the-art machine concepts - including a DuoFormer D, MasterJet Pro headbox and DuoShake DG - ensure the best possible quality for profiles and paper strengths. Other advantages include lower operating costs as well as fast and smooth grade changes. In addition, the press section was renewed and equipped with Voith's NipcoFlex technology for two shoe presses, which significantly increases dry content and capacity and reduces specific steam consumption. A fully automatic VariFlex NG winder with its proven technology rounds off the major rebuild. This features the unique Gecko OneStep system, which enables web separation as well as start and end gluing in just one step. In addition, it ensures stable winding quality at maximum speed thanks to an integrated drive control and the innovative SmoothRun hydro-pneumatic damping system.

Based in the Bavarian town of Ebersdorf bei Coburg, the Schumacher Packaging Group is one of the largest manufacturers of tailor-made corrugated and solid board packaging distributing throughout Europe.

The Voith Group is a global technology company.

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